锡膏是现代印刷电路板级电子组装技术----表面组装技术用之最重要连接材料。本公司一直以开创国际品牌锡膏为已任，并顺应环境保护之发展新越势，大力开展系统化科学研究，竭诚为您奉献具有自主品牌的锡膏系列产品和优良的技术服务。         For modern PCB-level electronic assembly using surface mount technlogy,solder paste is widely used as the joining material. We have made a lot of efforts to develop our solder paste with our own brand. With the aim to satisfy the market requirement and follow the dveloping tendency of environmental   protection,systematical research works are being carried out. We will do our best to provide series of solder paste products marked with our own brand and excell-ent technical support to promote the cooperation between us.
常 用 锡 膏 规 格 表
ZG63A1 ZG62AG2 ZG628AG04 ZG200C  溶   点          Melting point 179℃ 179℃ 179~183℃ 217~218℃ 锡粉合金成份Powder Alloying redient Sn63Pb37 Sn62Pb36Ag2 Sn62.8Pb36.8Ag0.4 Sn96.5Ag3.0Cu0.5  外  观            Aspect                               The outward appearance light gray   外观淡灰色，圆滑膏状无分层                               The smooth paste shape does not have the lamination  焊剂含量（wt%）  Solder Content 9.5±0.5 9.5±0.5 9.5±0.5 9.5±0.5  占素含量(wt%)           Halide content 0 0 0 0  粘    度（250℃)    Viscosity 210±20pa.s 210±20pa.s 210±20pa.s 210±20pa.s  颗粒体积（um）  Pellet volume IV                                                                    III                                                                    II 20-38                                                               25-45                                                              45-75 (-400+625目)                                                  (-325+500目)                                                 (-200+325目)                 Resisitivity    水卒取阻抗                                                                  Of water extract >1.0*105Ω.cm >1.0*105Ω.cm >1.0*105Ω.cm >1.0*105Ω.cm                  Chromic acid 铭酸银纸测试                                         Bank check test 合格Measure up 合格Measure up 合格Measure up 合格Measure up                 Corrosion test 铜板腐蚀测                                         On copper plate 合格Measure up 合格Measure up 合格Measure up 合格Measure up  表面绝缘           Sip  阻抗测试 40℃/90℃RH 1*1014Ω以上 1*1014Ω以上 1*1014Ω以上 1*1014Ω以上 80℃/85℃RH 5.0*1013Ω以上 5.0*1013Ω以上 5.0*1013Ω以上 5.0*1013Ω以上  扩展率（%)      Spread factor >90 >90 >90 >90  锡珠测试         Tin bead test 合格Measure up 合格Measure up 合格Measure up 合格Measure up  备注： 实验方法适用JIS。Z。3282和ANSI/J-STD-006。  锡粉合金成份JIS。Z。3910。        锡膏标签上型号后面如标有：IV（表示使用粉末为φ20-38um）II(表示使用粉末为φ45-75)III(表示使用粉末为φ25-45um)  Note: The testing method is suitable JIS.Z.3282 and ANSI/J-STD-006.   Powder alloy ingredient JIS.        On the tin paste label behind the model like the sign includes:IV(expression use powder II(expression          use powder III(expresses use powder for Phi 20-38um)for Phi 45-75um)for Phi 25-45um)