ZhongGang的无铅焊锡产品，均采用高纯度的锡银铜等原材料。所有的入厂原料都严格受控，有效杜绝了受欧盟ROHS指令设限的铅镉汞等有害金属元素产品的污染。同时，在上述有害元素的受控方面，ZhongGang严格按照LF-A(pb<100ppm cd<5ppm)和LF-B(pb<400ppm cd<10ppm)的指标加以控制。客户对铅镉汞等元素如有更高控制要求，公司可按客户的要求生产。
    无铅焊锡相对于传统的锡铅焊锡而言，润湿性差，且更容易氧化，易产生晶须。为克服上述缺陷，ZhongGang在这方面做了长期深入的研究，在工艺处理中增加脱氧，脱渣处理；并增加了特殊的抗氧化元素，明显克服了无铅焊锡的上述缺陷，出渣量明显减少，可焊性大大提高。

ZhongGang lead-free solder bars and balls come from the refined Tin,Silver,Copper.Allthe raw materials must pass the strict evaluation before saucing.In this way,the toxic elements such as Lead,Cd and Hg can be effectively prohibited,banned by EU ROHS directives.Meanwhile,we strictly controlled the above toxic materials according to LF-A"(Pb<100ppm;Cd<5ppm<and LEF-B(Pb<400ppm;Cd<10ppm)directives.And also,we can lower the toxic materials percentage in the solder,if our customers have higher demand.    Compared with the traditional Sn-Pb solder,lead-free solder has less better wetting,easily oxidized,and results in the tin tassels.Inorder to overcome the weakness,we have made a deep and long-term research and in the teehnology,we use deoxidizing and de-dross process and add special anti-oxidation elements.In this way,the weakness is basically resolved,which reduces the tin-dross and promote the solder ability.

高 温 无 铅 锡 条

在450℃的高温条件下，焊料表面能长期保持银白色的镜面状态，出渣量比普通无铅焊锡明显减少，适用于波峰焊和热侵焊工艺，特别适用于各种变压器制造时自溶漆包线的搪锡。低渣量的效果，不但减少了不良焊点，节约成本开支，同时减少了锡炉的维修机会。配有多种合金比例供客户选择。     Even under high temperature as 450℃,the liquid solder can keep a silvery white mirror-like surface.The amount of solder dross is only 1/7of that in the case of common solder bar.This product is suitable for wave soldering and hot dip tinning/soldering,especially for coil tinning in the manufacture process of transformer.Due to the feature of low solder dross,defect in the solder joints and maintenance of solder bath can be reduced and thus producing cost can be saved.We provide several alloy compositions for your choice.

低 温 无 铅 锡 条

液相线温度低于无铅焊锡熔点（227℃）的称做低温无铅锡条，低温无铅锡条是在锡中加入铋，银，铟，等成份而形成，多用于微电子温度传感器等较差的耐热零件之组装。     The liquidus temperature is lower than does not have the lead soldering tin melting point(227℃)is called as the low temperature not to have the lead bar tin,the low temperature does not have the lead bar tin is in the tin joins the bismith,the silver,the indium,and so on the ingredient but forms,uses in the micro electron temperature sensor and so on assembly the bad heat-resising components.